Browsing by Author "Talebanpour, Babak"

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MICROSTRUCTURAL EFFECTS ON CREEP AND FRACTURE MECHANICS OF SN-AG-CU SOLDERSMICROSTRUCTURAL EFFECTS ON CREEP AND FRACTURE OF Sn-Ag-Cu SOLDERS

Talebanpour, Babak (2015)

During service and/or storage, Sn-Ag-Cu (SAC) solder alloys are subjected to temperatures ranging from 0.4 to 0.8 Tm (where Tm is the melting temperature), while also experiencing cyclic strains. These conditions lead to ...