As labor cost keeps rising and labor availability remains increasingly uncertain, growers are seeking for mechanical harvesting solutions for tree fruit production. The goal of this research was to develop suitable vibratory ...

An important activity during harvesting is bin management, which traditionally requires heavy use of seasonal skilled labor. Due to increased labor cost and uncertainty with labor availability in recent years, tree fruit ...

In this study, improved analytical models are developed to characterize interface behavior of layered composite beam-type structures. The mechanics models of the bonded interface with and without adhesive layer are ...

Atomistic simulations have been used to study the effect of various types of point defects on the mechanical response of FCC single crystals in nanoindentation and uniaxial tests. To study the effect of spatial distribution ...

This work presents the fabrication and characterization of MEMS thermal interface materials. Different materials were used to fabricate and characterize different configurations of sample thermal interface materials. The ...

Open source product development refers to a paradigm where large numbers of participants collaborate in the form of communities to develop new products and services. The fundamental differences between traditional product ...

Excessive energy consumption has become a worldwide issue in today's design and manufacturing industry. A framework for estimating energy consumption that could later be used to integrate with CAD/CAM systems is in demand. ...

The objective of this research is to investigate the deformation behaviors of two types of NMMs at lower length scales: 1) One dimensional Cu-Ni, Au-Ni nanowires with coherent interfaces and 2) Two dimensional Cu-Nb ...

Thermoacoustic systems with no stacks or intermittent stacks represent a promising alternative to conventional stack-based systems. There is theoretical and experimental evidence that such systems can perform more efficiently ...

During service, micro-cracks form inside solder joints making a microelectronic package highly prone to failure during a drop. Hence, the fracture behavior of solder joints under drop conditions at high strain rates and ...